Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9714825 | Wafer shape thickness and trench measurement | David S. Marx | 2017-07-25 |
| 9587932 | System for directly measuring the depth of a high aspect ratio etched feature on a wafer | David S. Marx | 2017-03-07 |