DC

Damyon L. Corbin

IBM: 1 patents #5,570 of 10,852Top 55%
📍 Jericho, VT: #18 of 27 inventorsTop 70%
🗺 Vermont: #242 of 583 inventorsTop 45%
Overall (2017): #451,790 of 506,227Top 90%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9543175 Package assembly for thin wafer shipping and method of use Charles F. Musante 2017-01-10