Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748154 | Wafer level fan out semiconductor device and manufacturing method thereof | Boo Yang Jung, Jong Sik Paek, In Bae Park, Sang Won Kim, Sung Kyu Kim +1 more | 2017-08-29 |
| 9627348 | Laser assisted bonding for semiconductor die interconnections | Dong Su Ryu, Min Ho Kim, Choong Hoe Kim, Ju Hoon Yoon, Chan Ha Hwang +1 more | 2017-04-18 |
| 9627368 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Doo Hyun Park, Ju Hoon Yoon, Seong Min Seo, Glenn Rinne | 2017-04-18 |