Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9646910 | Integrated heat spreader that maximizes heat transfer from a multi-chip package | Eric W. Buddrius, Roger D. Flynn, Rajat Agarwal | 2017-05-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9646910 | Integrated heat spreader that maximizes heat transfer from a multi-chip package | Eric W. Buddrius, Roger D. Flynn, Rajat Agarwal | 2017-05-09 |