CL

Chew Ching Lim

IN Intel: 1 patents #2,217 of 5,604Top 40%
📍 Sungai Petani, MY: #2 of 3 inventorsTop 70%
Overall (2017): #462,558 of 506,227Top 95%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9633874 Package substrate warpage reshaping apparatus and method Ken Beng Lim 2017-04-25