Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831225 | Low-impedance power delivery for a packaged die | Gurpreet Shinh, Donald E. Templeton, Brian Schieck | 2017-11-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831225 | Low-impedance power delivery for a packaged die | Gurpreet Shinh, Donald E. Templeton, Brian Schieck | 2017-11-28 |