Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831159 | Semiconductor package with embedded output inductor | Eung San Cho, Darryl Galipeau | 2017-11-28 |
| 9640474 | Power semiconductor package having power semiconductor die in a support substrate with bar vias | Eung San Cho | 2017-05-02 |