Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812373 | Semiconductor package with top side cooling heat sink thermal pathway | Ralf Otremba, Klaus Schiess, Franz Stueckler | 2017-11-07 |
| 9773736 | Intermediate layer for copper structuring and methods of formation thereof | Ravi Keshav Joshi, Juergen Steinbrenner, Petra Fischer, Roman Roth | 2017-09-26 |
| 9679895 | Semiconductor device having switchable regions with different transconductances | Enrique Vecino Vazquez, Armin Willmeroth | 2017-06-13 |
| 9583395 | Method for manufacturing a semiconductor switching device with different local cell geometry | Enrique Vecino Vazquez | 2017-02-28 |