RL

Rudolf Lehner

Infineon Technologies Ag: 1 patents #362 of 917Top 40%
📍 Hemau, DE: #2 of 9 inventorsTop 25%
Overall (2017): #258,718 of 506,227Top 55%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9536816 Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure Angela Kessler, Eduard Knauer, Wolfgang Schober, Sigrid Schultes 2017-01-03