Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741677 | Semiconductor device including antistatic die attach material | Volker Strutz, Franz-Peter Kalz | 2017-08-22 |
| 9728493 | Mold PackageD semiconductor chip mounted on a leadframe and method of manufacturing the same | Volker Strutz | 2017-08-08 |
| 9564578 | Semiconductor package with integrated magnetic field sensor | Thorsten Meyer, Martin Gruber, Franz Jost, Stefan Mieslinger, Liu Chen +4 more | 2017-02-07 |