Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9633927 | Chip arrangement and method for producing a chip arrangement | Joachim Mahler, Alfred Haimerl, Angela Kessler | 2017-04-25 |
| 9576935 | Method for fabricating a semiconductor package and semiconductor package | Ludwig Heitzer, Christian Stuempfl | 2017-02-21 |