Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780061 | Molded chip package and method of manufacturing the same | Horst Theuss | 2017-10-03 |
| 9548248 | Method of processing a substrate and a method of processing a wafer | Frank Pueschner, Bernhard Schaetzler | 2017-01-17 |