Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9653426 | Method of manufacturing a semiconductor package having an integrated microwave component | Maciej Wojnowski, Walter Hartner, Josef Boeck | 2017-05-16 |
| 9583811 | Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compound | Maciej Wojnowski, Walter Hartner, Josef Boeck | 2017-02-28 |