Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9731370 | Directly cooled substrates for semiconductor modules and corresponding manufacturing methods | Andre Uhlemann | 2017-08-15 |
| 9585241 | Substrate, chip arrangement, and method for manufacturing the same | Wolfram Hable, Andreas Grassmann, Frank Winter, Ottmar Geitner, Alexander Schwarz | 2017-02-28 |