Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806043 | Method of manufacturing molded semiconductor packages having an optical inspection feature | Swee Kah Lee, Hock Heng Chong, Mei Chin Ng, Fong Mei Lum, Muhammad Muhammat Sanusi +1 more | 2017-10-31 |