Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9601474 | Electrically stackable semiconductor wafer and chip packages | Ching-Wen Hsaio, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2017-03-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9601474 | Electrically stackable semiconductor wafer and chip packages | Ching-Wen Hsaio, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2017-03-21 |