Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9710592 | Multiple-depth trench interconnect technology at advanced semiconductor nodes | Vincent J. McGahay, Rasit Onur Topaloglu | 2017-07-18 |
| 9601367 | Interconnect level structures for confining stitch-induced via structures | Rasit Onur Topaloglu | 2017-03-21 |
| 9589911 | Integrated circuit structure with metal crack stop and methods of forming same | Jim Shih-Chun Liang, Atsushi Ogino, Roger QUON | 2017-03-07 |
| 9589912 | Integrated circuit structure with crack stop and method of forming same | Jim Shih-Chun Liang, Atsushi Ogino, Roger QUON | 2017-03-07 |