Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9839128 | Solder void reduction between electronic packages and printed circuit boards | — | 2017-12-05 |
| 9560737 | Electronic package with heat transfer element(s) | Michael T. Peets, Xiaojin Wei | 2017-01-31 |