Issued Patents 2017
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818667 | Compute intensive module packaging | Amilcar R. Arvelo, Eric J. McKeever, Thong N. Nguyen, Edward J. Seminaro | 2017-11-14 |
| 9811097 | Environmental control of liquid cooled electronics | Ravi Kumar Arimilli, Edward J. Seminaro | 2017-11-07 |
| 9795055 | Electronics cooling assembly with multi-position, airflow-blocking mechanism | Levi A. Campbell, Milnes P. David, Dustin W. Demetriou | 2017-10-17 |
| 9763357 | Fabricating a liquid-cooling apparatus with coolant filter | Levi A. Campbell, Richard C. Chu, Milnes P. David, Madhusudan K. Iyengar, Roger R. Schmidt +1 more | 2017-09-12 |
| 9761508 | Composite heat sink structures | Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Roger R. Schmidt, Robert E. Simons | 2017-09-12 |
| 9746109 | Fabricating formed hose with different fiber-reinforced regions | Prabjit Singh | 2017-08-29 |
| 9750159 | Pump-enhanced, immersion-cooling of electronic compnent(s) | Levi A. Campbell, Richard C. Chu, Milnes P. David, Madhusudan K. Iyengar, Roger R. Schmidt +1 more | 2017-08-29 |
| 9733148 | Measuring moisture leakage through liquid-carrying hardware | Michael G. Betro, Enrico A. Romano, Prabjit Singh, Jing Zhang | 2017-08-15 |
| 9726829 | Blind mating strain relieved optical fiber connector | Alan F. Benner, Mark A. Brandon, Eric J. McKeever, Thong N. Nguyen, Edward J. Seminaro | 2017-08-08 |
| 9720184 | Blind mating strain relieved optical fiber connector | Alan F. Benner, Mark A. Brandon, Eric J. McKeever, Thong N. Nguyen, Edward J. Seminaro | 2017-08-01 |
| 9687943 | Heat sink structure with a vapor-permeable membrane for two-phase cooling | Levi A. Campbell, Richard C. Chu, Milnes P. David, Madhusudan K. Iyengar, Robert E. Simons | 2017-06-27 |
| 9686891 | Thermoelectric-enhanced, inlet air cooling for an electronics rack | Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Roger R. Schmidt, Robert E. Simons | 2017-06-20 |
| 9686889 | Field-replaceable bank of immersion-cooled electronic components | Levi A. Campbell, Richard C. Chu, Milnes P. David, Madhusudan K. Iyengar, Roger R. Schmidt +1 more | 2017-06-20 |
| 9661784 | Multi-component electronic module with integral coolant-cooling | Amilcar R. Arvelo, Levi A. Campbell, Eric J. McKeever | 2017-05-23 |
| 9647762 | Integrated parallel optical transceiver | Amilcar R. Arvelo, Alan F. Benner, Eric J. McKeever, Thong N. Nguyen, Edward J. Seminaro | 2017-05-09 |
| 9623520 | Heat sink structure with a vapor-permeable membrane for two-phase cooling | Levi A. Campbell, Richard C. Chu, Milnes P. David, Madhusudan K. Iyengar, Robert E. Simons | 2017-04-18 |
| 9629286 | Thermoelectric-enhanced, inlet air cooling for an electronics rack | Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Roger R. Schmidt, Robert E. Simons | 2017-04-18 |
| 9622379 | Drawer-level immersion-cooling with hinged, liquid-cooled heat sink | Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Roger R. Schmidt, Robert E. Simons | 2017-04-11 |
| 9591787 | Selective clamping of electronics card to coolant-cooled structure | Amilcar R. Arvelo, Mark A. Brandon, Levi A. Campbell, Tan D. Doan, Randall G. Kemink +1 more | 2017-03-07 |
| 9562824 | Measuring moisture leakage through liquid-carrying hardware | Michael G. Betro, Enrico A. Romano, Prabjit Singh, Jing Zhang | 2017-02-07 |