Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9733134 | Solder assembly temperature monitoring process | Stephen M. Hugo | 2017-08-15 |
| 9714870 | Solder assembly temperature monitoring process | Stephen M. Hugo | 2017-07-25 |
| 9662732 | Increasing solder hole-fill in a printed circuit board assembly | Stephen M. Hugo | 2017-05-30 |
| 9591795 | Sensor-based removal of a soldered device | Willie T. Davis, Jr., Michk Huang | 2017-03-07 |
| 9563739 | Technology for temperature sensitive components in thermal processing | Mitchell G. Ferrill, Curtis T. Grosskopf, Thomas H. Lewis, Wen Wei Low | 2017-02-07 |