Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9831151 | Heat sink for semiconductor modules | — | 2017-11-28 | $4,993,000 |
| 9709964 | Genset power control in power systems | — | 2017-07-18 | $14,268,000 |
| 9702767 | Calibrating thermal behavior of electronics | Timothy J. Chainer, Pritish R. Parida | 2017-07-11 | $1,748,000 |
| 9678289 | Thermal management of optical coupling systems | Shurong Tian | 2017-06-13 | $2,356,000 |
| 9634959 | High-density, fail-in-place switches for computer and data networks | Paul W. Coteus, Fuad E. Doany, Shawn A. Hall, Todd E. Takken, Shurong Tian | 2017-04-25 | $1,937,000 |
| 9570373 | Near-chip compliant layer for reducing perimeter stress during assembly process | Todd E. Takken, Shurong Tian, Yuan Yao | 2017-02-14 | $1,939,000 |
| 9534967 | Calibrating thermal behavior of electronics | Timothy J. Chainer, Pritish R. Parida | 2017-01-03 | $2,646,000 |