Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9761542 | Liquid metal flip chip devices | ASSANE NDIEGUENE, Pierre Albert | 2017-09-12 |
| 9735125 | Thermocompression for semiconductor chip assembly | — | 2017-08-15 |
| 9698072 | Low-stress dual underfill packaging | Peter J. Brofman, Marie-Claude Paquet | 2017-07-04 |