HL

Hong Lin

SC Shanghai Ic R&D Center Co.: 1 patents #1 of 10Top 10%
📍 Shanghai, NY: #24 of 47 inventorsTop 55%
Overall (2017): #398,934 of 506,227Top 80%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9640434 Method for processing an electroplated copper film in copper interconnect process 2017-05-02