Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9825119 | Semiconductor device with metal extrusion formation | Max G. Levy, Gary L. Milo | 2017-11-21 |
| 9825120 | Semiconductor device with metal extrusion formation | Max G. Levy, Gary L. Milo | 2017-11-21 |
| 9607929 | Tsv wafer with improved fracture strength | James W. Adkisson, Yoba Amoah, Jeffrey P. Gambino, Christine A. Leggett, Max L. Lifson +2 more | 2017-03-28 |
| 9548349 | Semiconductor device with metal extrusion formation | Max G. Levy, Gary L. Milo | 2017-01-17 |