BS

Brian R. Sundlof

IBM: 1 patents #5,570 of 10,852Top 55%
📍 Verbank, NY: #1 of 1 inventorsTop 100%
🗺 New York: #4,556 of 12,278 inventorsTop 40%
Overall (2017): #472,810 of 506,227Top 95%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9640501 Multilayer pillar for reduced stress interconnect and method of making same Virendra R. Jadhav, Krystyna W. Semkow, Kamalesh K. Srivastava 2017-05-02