Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9761520 | Method of making an electrical connector having electrodeposited terminals | — | 2017-09-12 |
| 9755335 | Low profile electrical interconnect with fusion bonded contact retention and solder wick reduction | — | 2017-09-05 |
| 9699906 | Hybrid printed circuit assembly with low density main core and embedded high density circuit regions | — | 2017-07-04 |
| 9689897 | Performance enhanced semiconductor socket | — | 2017-06-27 |
| 9660368 | High performance surface mount electrical interconnect | — | 2017-05-23 |
| 9613841 | Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection | — | 2017-04-04 |
| 9603249 | Direct metalization of electrical circuit structures | — | 2017-03-21 |
| 9559447 | Mechanical contact retention within an electrical connector | — | 2017-01-31 |
| 9536815 | Semiconductor socket with direct selective metalization | — | 2017-01-03 |