Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9713284 | Locally enhanced direct liquid cooling system for high power applications | Ya LV, Yat Kit Tsui | 2017-07-18 |
| 9704819 | Three dimensional fully molded power electronics module having a plurality of spacers for high power applications | Ya LV | 2017-07-11 |