Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773738 | Circuit substrate for semiconductor package with multiple circuit substrate units and semiconductor package therefor | Yutaka Uematsu, Junichi Masukawa | 2017-09-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773738 | Circuit substrate for semiconductor package with multiple circuit substrate units and semiconductor package therefor | Yutaka Uematsu, Junichi Masukawa | 2017-09-26 |