Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9668345 | Multilayer wiring board with metal foil wiring layer, wire wiring layer, and interlayer conduction hole | Hiroyuki Yamaguchi, Seiichi Kurihara, Hiroshi Sakurai | 2017-05-30 |