Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9661763 | Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition | Daisuke Fujimoto, Kunpei Yamada, Toshimasa Nagoshi | 2017-05-23 |