Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9589694 | Alloyed 2N copper wires for bonding in microelectronics devices | Murali Sarangapani, Ping Ha YEUNG | 2017-03-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9589694 | Alloyed 2N copper wires for bonding in microelectronics devices | Murali Sarangapani, Ping Ha YEUNG | 2017-03-07 |