Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9756730 | Chip-integrated through-plating of multi-layer substrates | Andreas Klein, Frank Krüger, Michael Schumann | 2017-09-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9756730 | Chip-integrated through-plating of multi-layer substrates | Andreas Klein, Frank Krüger, Michael Schumann | 2017-09-05 |