Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9795040 | Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards | Jen-Chieh Wei, Steven Z. Shi, Werner G. Kuhr | 2017-10-17 |
| 9763336 | Methods of treating metal surfaces and devices formed thereby | Jen-Chieh Wei, Steven Z. Shi, Werner G. Kuhr | 2017-09-12 |