Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9698132 | Chip package stack up for heat dissipation | Roger W. Ady, Morris B. Bowers | 2017-07-04 |
| 9645618 | Skin oscillation convective cooling | Alberto R. Cavallaro, Morris B. Bowers, Martin R. Pais, Maninder S. Sehmbey | 2017-05-09 |