Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9627317 | Wafer with improved plating current distribution | Thomas Werner, Frank Feustel | 2017-04-18 |
| 9543199 | Long-term heat treated integrated circuit arrangements and methods for producing the same | Wolfgang Hasse, Martina Hommel, Heinrich Koerner | 2017-01-10 |