Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847251 | Diffusion barrier layer formation | Brett H. Engel, Arun Vijayakumar, Keith Kwong Hon Wong | 2017-12-19 |
| 9691658 | Contact fill in an integrated circuit | Emre Alptekin, Raghu Mangu, Cung D. Tran | 2017-06-27 |
| 9633946 | Seamless metallization contacts | Jim Shih-Chun Liang, Kathryn T. Schonenberg, Shahrukh Khan, Wei-Tsu Tseng | 2017-04-25 |