Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9805971 | Method of forming a via contact | Rui Li, Chin Chuan Neo | 2017-10-31 |
| 9564575 | Dual encapsulation integration scheme for fabricating integrated circuits with magnetic random access memory structures | Danny Pak-Chum Shum, Yi Jiang, Juan Boon Tan | 2017-02-07 |