Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9709619 | Printed wiring board, crack prediction device, and crack prediction method | Naoki Nakamura, Shigeru Sugino, Takahide Mukoyama, Ryo Kanai, Nobuo Taketomi +1 more | 2017-07-18 |
| 9591763 | Substrate with embedded component | Mitsunori Abe, Kiyoyuki Hatanaka, Nobuo Taketomi, Ryo Kanai, Naoki Nakamura | 2017-03-07 |