Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9781836 | Thermosetting resin composition, method for forming protective film for flexible wiring board, and flexible wiring board | Iori Hukushima, Tomohiro Hirata, Hidekazu Kondou, Susumu Kaneko, Yuki Miyamoto | 2017-10-03 |