Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721928 | Integrated circuit package having two substrates | Navas Khan Oratti Kalandar, Chetan Verma | 2017-08-01 |
| 9589928 | Combined QFN and QFP semiconductor package | Zhigang Bai, Jinzhong Yao | 2017-03-07 |