Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741591 | Wafer level packaging of microbolometer vacuum package assemblies | Paul Schweikert, Andrew Sharpe, Gregory A. Carlson, Alex Matson, Scott Vilander +1 more | 2017-08-22 |