Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831201 | Methods for forming pillar bumps on semiconductor wafers | Guy F. Burgess, Theodore G. Tessier, Lillian C. Thompson | 2017-11-28 |
| 9627254 | Method for building vertical pillar interconnect | Guy F. Burgess, Eugene A. Stout, Theodore G. Tessier, Lillian C. Thompson | 2017-04-18 |