Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9685398 | Thin semiconductor device packages | Margie T. Rios, Aira Lourdes Villamor, Armand Vincent C. Jereza | 2017-06-20 |
| 9583454 | Semiconductor die package including low stress configuration | Maria Clemens Y. Quinones | 2017-02-28 |
| 9536800 | Packaged semiconductor devices and methods of manufacturing | Ahmad Ashrafzadeh, Adrian Mikolajczak, Chung-Lin Wu | 2017-01-03 |