Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9802814 | Through silicon via including multi-material fill | David Lambe Marx, Brian Bircumshaw | 2017-10-31 |
| 9735112 | Isolation between semiconductor components | John Constantino, Timwah Luk, Ahmad Ashrafzadeh, Robert L. Krause, Etan Shacham +2 more | 2017-08-15 |
| 9586813 | Multi-die MEMS package | John Gardner Bloomsburgh, Cenk Acar | 2017-03-07 |