Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9613858 | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers | Xuan Lin, Richard Hurtubise, Qingyun Chen | 2017-04-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9613858 | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers | Xuan Lin, Richard Hurtubise, Qingyun Chen | 2017-04-04 |