Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847263 | Substrate processing method including reprocessing rejected wafers | HIROFUMI OTAKI | 2017-12-19 |
| 9610673 | Polishing method and apparatus | — | 2017-04-04 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847263 | Substrate processing method including reprocessing rejected wafers | HIROFUMI OTAKI | 2017-12-19 |
| 9610673 | Polishing method and apparatus | — | 2017-04-04 |