Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9836236 | SPI interface enhanced flash chip and chip packaging method | Qingming Shu, Hong Hu, Sai Zhang, Jianjun Zhang, Ronghua Pan | 2017-12-05 |
| 9784445 | External bed type double-fluidized bed system for preventing boiler contamination | Liyong Cao, Wei Fan, Qi Du, Pan Guo, Zhengning Liu +5 more | 2017-10-10 |
| 9728520 | Enhanced flash chip and method for packaging chip | Hong Hu, Qingming Shu, Sai Zhang, Jianjun Zhang, Ronghua Pan | 2017-08-08 |