Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9779993 | Wafer processing method including attaching a protective tape to a front side of a functional layer to prevent debris adhesion | Yuki Ogawa, Kensuke Nagaoka, Tsubasa Obata | 2017-10-03 |
| 9716039 | Wafer processing method | Yuki Ogawa, Kensuke Nagaoka, Tsubasa Obata | 2017-07-25 |
| 9536787 | Wafer processing method | Yuki Ogawa, Kensuke Nagaoka, Tsubasa Obata | 2017-01-03 |