Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9650522 | Absorbing-layer-forming composition and absorbing substrate, printed item, conductive pattern, and electric circuit produced using the same | Wataru Fujikawa, Jun Shirakami, Akira Murakawa | 2017-05-16 |
| 9629253 | Method for forming high-definition metal pattern, high-definition metal pattern, and electronic component | Sunao Yoshihara, Haruhiko Katsuta, Yoshinori Katayama, Jun Shirakami, Akira Murakawa +1 more | 2017-04-18 |