Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806010 | Package module and method of fabricating the same | Zhen-Qing ZHAO, Tao Wang | 2017-10-31 |
| 9748205 | Molding type power module | Zhenqing Zhao, Tao Wang, Le Liang | 2017-08-29 |
| 9679786 | Packaging module of power converting circuit and method for manufacturing the same | Shouyu Hong, Zhenqing Zhao | 2017-06-13 |
| 9653424 | Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method | Xiaotian Zhang, Jun Lu | 2017-05-16 |